Multilayer Isolation Structure for High Voltage Silicon-On-Insulator Device

ABSTRACT

Deep trench isolation structures for high voltage semiconductor-on-insulator devices are disclosed herein. An exemplary deep trench isolation structure surrounds an active region of a semiconductor-on-insulator substrate. The deep trench isolation structure includes a first insulator sidewall spacer, a second insulator sidewall spacer, and a multilayer silicon-comprising isolation structure disposed between the first insulator sidewall spacer and the second insulator sidewall spacer. The multilayer silicon-comprising isolation structure includes a top polysilicon portion disposed over a bottom silicon portion. The bottom polysilicon portion is formed by a selective deposition process, while the top polysilicon portion is formed by a non-selective deposition process. In some embodiments, the bottom silicon portion is doped with boron.

This application is a non-provisional application of and claims benefitof U.S. Provisional Patent Application Ser. No. 63/059,089, filed Jul.30, 2020, the entire disclosure of which is incorporated herein byreference.

BACKGROUND

The integrated circuit (IC) industry has experienced exponential growth.Technological advances in IC materials and design have producedgenerations of ICs, where each generation has smaller and more complexcircuits than the previous generation. In the course of IC evolution,functional density (i.e., the number of interconnected devices per chiparea) has generally increased while geometry size (i.e., the smallestcomponent (or line) that can be created using a fabrication process) hasdecreased. This scaling down process generally provides benefits byincreasing production efficiency and lowering associated costs.

Such scaling down has also increased the complexity of processing andmanufacturing ICs. For example, crosstalk has become a significantchallenge as more IC devices, circuits, and/or systems having multiplefunctionalities are being densely packed onto a single substrate to meetadvanced IC technology demands. Often, crosstalk arises from capacitive,inductive, and/or conductive coupling between IC devices and/or ICcomponents on the same substrate. Semiconductor-on-insulator (SOI)technology has been implemented to improve isolation and suppresscrosstalk between IC devices and/or IC components. In SOI technology, ICdevices are fabricated on a semiconductor-insulator-semiconductorsubstrate, such as a silicon layer-oxide layer-silicon layer substrate,instead of a bulk semiconductor substrate. Additional isolationstructures, such as shallow trench isolation structures and/or deeptrench isolation structures, are often further incorporated into SOIsubstrates to further improve isolation and suppress crosstalk. Althoughexisting isolation structures implemented in SOI substrates have beengenerally adequate for their intended purposes, they have not beenentirely satisfactory in all respects and improvements are needed as ICtechnologies scale.

BRIEF DESCRIPTION OF THE DRAWINGS

The present disclosure is best understood from the following detaileddescription when read with the accompanying figures. It is emphasizedthat, in accordance with the standard practice in the industry, variousfeatures are not drawn to scale and are used for illustration purposesonly. In fact, the dimensions of the various features may be arbitrarilyincreased or reduced for clarity of discussion.

FIG. 1 depicts fragmentary cross-sectional views of fabrication of threedifferent polysilicon isolation features, in portion or entirety, thatcan be integrated into a semiconductor-on-insulator substrate accordingto various aspects of the present disclosure.

FIG. 2 depicts a fragmentary cross-sectional view of fabrication of asilicon-comprising isolation feature, in portion or entirety, that canbe integrated into a semiconductor-on-insulator substrate according tovarious aspects of the present disclosure.

FIG. 3 depicts a log-linear graph that correlates log defect densitywith an etch/deposition ratio according to various aspects of thepresent disclosure

FIG. 4A is a fragmentary top view of an isolation feature of anintegrated circuit (IC) device, in portion or entirety, according tovarious aspects of the present disclosure.

FIG. 4B is a fragmentary cross-sectional view of the isolation featureof the IC device of FIG. 1A, in portion or entirety, according tovarious aspects of the present disclosure.

FIG. 5 is a diagrammatic cross-sectional view of another isolationfeature of an IC device, in portion or entirety, according to variousaspects of the present disclosure.

FIG. 6 is a diagrammatic cross-sectional view of another isolationfeature of an IC device, in portion or entirety, according to variousaspects of the present disclosure.

FIG. 7 is a diagrammatic cross-sectional view of another isolationfeature of an IC device, in portion or entirety, according to variousaspects of the present disclosure.

FIG. 8 is a diagrammatic cross-sectional view of another isolationfeature of an IC device, in portion or entirety, according to variousaspects of the present disclosure.

FIG. 9 is a fragmentary top view of another isolation feature of an ICdevice, in portion or entirety, according to various aspects of thepresent disclosure.

DETAILED DESCRIPTION

The present disclosure relates generally to integrated circuit devices,and more particularly, to isolation structures for integrated circuitdevices, such as deep trench isolation structures for high voltagesilicon-on-insulator devices.

The following disclosure provides many different embodiments, orexamples, for implementing different features of the invention. Specificexamples of components and arrangements are described below to simplifythe present disclosure. These are, of course, merely examples and arenot intended to be limiting. For example, the formation of a firstfeature over or on a second feature in the description that follows mayinclude embodiments in which the first and second features are formed indirect contact and may also include embodiments in which additionalfeatures may be formed between the first and second features, such thatthe first and second features may not be in direct contact. In addition,spatially relative terms, for example, “lower,” “upper,” “horizontal,”“vertical,” “above,” “over,” “below,” “beneath,” “up,” “down,” “top,”“bottom,” etc. as well as derivatives thereof (e.g., “horizontally,”“downwardly,” “upwardly,” etc.) are used for ease of the presentdisclosure of one features relationship to another feature. Thespatially relative terms are intended to cover different orientations ofthe device including the features. Furthermore, when a number or a rangeof numbers is described with “about,” “approximate,” and the like, theterm is intended to encompass numbers that are within a reasonable rangeconsidering variations that inherently arise during manufacturing asunderstood by one of ordinary skill in the art. For example, the numberor range of numbers encompasses a reasonable range including the numberdescribed, such as within +/−10% of the number described, based on knownmanufacturing tolerances associated with manufacturing a feature havinga characteristic associated with the number. For example, a materiallayer having a thickness of “about 5 nm” can encompass a dimension rangefrom 4.5 nm to 5.5 nm where manufacturing tolerances associated withdepositing the material layer are known to be +/−10% by one of ordinaryskill in the art. Still further, the present disclosure may repeatreference numerals and/or letters in the various examples. Thisrepetition is for the purpose of simplicity and clarity and does not initself dictate a relationship between the various embodiments and/orconfigurations discussed.

Crosstalk arises from capacitive, inductive, and/or conductive couplingbetween integrated circuit (IC) devices and/or IC components on the samesubstrate. Semiconductor-on-insulator (SOI) technology has beenimplemented to improve isolation and suppress crosstalk between ICdevices and/or IC components. In SOI technology, IC devices arefabricated on a semiconductor-insulator-semiconductor substrate, such asa silicon layer-oxide layer-silicon layer substrate, instead of a bulksemiconductor substrate. Additional isolation structures, such asshallow trench isolation structures (STIs) and/or deep trench isolationstructures (DTIs), are often further incorporated into SOI substrates tofurther improve isolation and suppress crosstalk. FIG. 1 depictsfragmentary cross-sectional views of fabrication of three differentpolysilicon DTIs, in portion or entirety, that can be integrated intoSOI substrates according to various aspects of the present disclosure.In FIG. 1, fabrication of each of the polysilicon DTIs begins withreceiving an SOI substrate 10 (including, for example, an insulatorlayer 12 disposed between a semiconductor layer 14 and a semiconductorlayer 16) and forming a patterning layer 20 over SOI substrate 10, wherepatterning layer 20 has an opening therein that exposes a portion of SOIsubstrate 10. Patterning layer 20 can include a pad layer and a masklayer, where the pad layer is disposed on semiconductor layer 14 and themask layer is disposed on the pad layer. In some embodiments, the padlayer includes silicon and oxygen, and the mask layer includes siliconand nitrogen. For example, the pad layer is a silicon oxide layer formedby thermal oxidation and/or other suitable process, and the mask layeris a silicon nitride layer or a silicon oxynitride layer formed bychemical vapor deposition (CVD), low pressure CVD (LPCVD), plasmaenhanced CVD (PECVD), thermal nitridation (for example, of silicon),other suitable process, or combinations thereof. In some embodiments,the pad layer includes a material that can promote adhesion between SOIsubstrate 105 and the mask layer and can further act as an etch stoplayer when removing the mask layer. Other materials for and/or methodsfor forming the pad layer and/or the mask layer are contemplated by thepresent disclosure.

The opening is formed in the mask layer and the pad layer by performinga lithography process to form a patterned resist layer over patterninglayer 20 and performing an etching process to transfer a pattern formedin the patterned resist layer to patterning layer 20. The lithographyprocess can include forming a resist layer on the mask layer (forexample, by spin coating), performing a pre-exposure baking process,performing an exposure process using a mask, performing a post-exposurebaking process, and performing a developing process. During the exposureprocess, the resist layer is exposed to radiation energy (such asultraviolet (UV) light, deep UV (DUV) light, or extreme UV (EUV) light),where the mask blocks, transmits, and/or reflects radiation to theresist layer depending on a mask pattern of the mask and/or mask type(for example, binary mask, phase shift mask, or EUV mask), such that animage is projected onto the resist layer that corresponds with the maskpattern. Since the resist layer is sensitive to radiation energy,exposed portions of the resist layer chemically change, and exposed (ornon-exposed) portions of the resist layer are dissolved during thedeveloping process depending on characteristics of the resist layer andcharacteristics of a developing solution used in the developing process.After development, the patterned resist layer includes a resist patternthat corresponds with the mask. The etching process uses the patternedresist layer as an etch mask to remove portions of the mask layer andthe pad layer, thereby forming the opening that extends throughpatterning layer 20. The etching process can include a dry etchingprocess (for example, a reactive ion etching (RIE) process), a wetetching process, other suitable etching process, or combinationsthereof. After the etching process, the patterned resist layer can beremoved, for example, by a resist stripping process. Alternatively, theexposure process can implement maskless lithography, electron-beamwriting, and/or ion-beam writing.

An isolation trench etching process is then performed using patterninglayer 20 as an etch mask to form an isolation trench 30 in SOI substrate10. Portions of SOI substrate 10 exposed by the opening in patterninglayer 20 are removed by the isolation trench etching process, such thatisolation trench 30 extends through semiconductor layer 14 and insulatorlayer 12 to expose semiconductor layer 16. Isolation trench 30 has asidewall 32 formed by semiconductor layer 14 and insulator layer 12, asidewall 34 formed by semiconductor layer 14 and insulator layer 12, anda bottom 36 formed by semiconductor layer 16. In FIG. 1, the isolationtrench etching process slightly etches semiconductor layer 16, such thatbottom 36 is formed by a recessed, curved surface of semiconductor layer16, which extends below a topmost surface 38 of semiconductor layer 16.Isolation trench 30 is a high aspect ratio trench, which generallyrefers to a trench having one dimension that is substantially greaterthan another dimension. For example, isolation trench 30 has a depthdefined along a z-direction and a width w defined along an x-direction,where depth d is substantially greater than width w. In someembodiments, a ratio of depth d to width w is greater than about 5. Theisolation trench etching process is a dry etching process, a wet etchingprocess, or combinations thereof.

Fabrication then proceeds with depositing an oxide layer 40 over SOIsubstrate 10 and patterning layer 20, where oxide layer 40 partiallyfills isolation trench 30. After deposition, oxide layer 40 coverspatterning layer 20 and further covers sidewall 32, sidewall 34, andbottom 36 of isolation trench 30. An etching process is then performedthat removes oxide layer 40 from bottom 36 of isolation trench 30. Afterthe etching process, oxide layer 40 covers sidewall 32 and sidewall 34of isolation trench 30 but not a portion of bottom 36 of isolationtrench 30. Any suitable deposition process is implemented for formingoxide layer 40, such as CVD, physical vapor deposition (PVD), atomiclayer deposition (ALD), high density plasma CVD (HDPCVD), metal organicCVD (MOCVD), remote plasma CVD (RPCVD), rapid thermal CVD (RTCVD),PECVD, plasma enhanced ALD (PEALD), LPCVD, atomic layer CVD (ALCVD),atmospheric pressure CVD (APCVD), other suitable methods, orcombinations thereof. In the depicted embodiment, oxide layer 40 isformed by a high aspect ratio deposition process (HARP), such as HDPCVD.HARP generally refers to a deposition process that can achieve adequatefilling of high aspect ratio structures, such as high aspect ratiotrenches, such as isolation trench 30. The etching process is ananisotropic etch process, which generally refers to an etch processhaving different etch rates in different directions, such that the etchprocess removes material in specific directions, such as substantiallyin one direction. For example, the etching has a vertical etch rate thatis greater than a horizontal etch rate (in some embodiments, thehorizontal etch rate equals zero). The anisotropic etch process thusremoves material in substantially the vertical direction (here,z-direction) with minimal (to no) material removal in the horizontaldirection (here, x-direction and/or y-direction). In such embodiments,the anisotropic etch does not remove, or minimally removes, oxide layer40 covering sidewall 32 and sidewall 34 of isolation trench 30 and maypartially or completely remove oxide layer 40 covering patterning layer20. In some embodiments, a thickness of oxide layer 40 at upper cornersof isolation trench 30 may be slightly reduced by the anisotropic etchprocess, such as depicted in FIG. 1. In some embodiments, a thickness ofoxide layer 40 covering patterning layer 20 is reduced by theanisotropic etch process. The anisotropic etch process can be a dryetching process, a wet etching process, or combinations thereof. In someembodiments, the etching process is a dry etching process, such as areactive ion etching (RIE) process.

Fabrication can then proceed with process A to form a polysilicon DTI50A, process B to form a polysilicon DTI 50B, or process C to form apolysilicon DTI 50C. Process A includes depositing a polysilicon layer52A over oxide layer 40 to fill a remainder of isolation trench 30 andperforming a planarization process to remove portions of polysiliconlayer 52A disposed over oxide layer 40, such that a top surface ofpolysilicon layer 52A and a top surface of oxide layer 40 aresubstantially planar. A planarization process is then performed (or theplanarization process is continued) to remove portions of oxide layer 40disposed over patterning layer 20, such that the top surface ofpolysilicon layer 52A, the top surface of oxide layer 40, and the topsurface of patterning layer 20 are substantially planar. Thereafter,patterning layer 20 is removed from over SOI substrate 10. PolysiliconDTI 50A thus has an oxide sidewall 40-1 (i.e., a remainder of oxidelayer 40 disposed along sidewall 32 of isolation trench 30), an oxidesidewall 40-2 (i.e., a remainder of oxide layer disposed along sidewall34 of isolation trench 30), and polysilicon layer 52A disposed betweenoxide sidewall 40-1 and oxide sidewall 40-2. Polysilicon layer 52Aphysically contacts semiconductor layer 16 of SOI substrate 10.Polysilicon layer 52A includes polycrystalline silicon, which is alsoreferred to as multi-crystalline silicon or polysilicon. Polycrystallinesilicon generally includes multiple silicon grains (crystals) separatedby grain boundaries (i.e., grains of monocrystalline silicon, which canbe oriented randomly and have different crystal orientations).

In process A, polysilicon layer 52A is formed by a non-selectivedeposition process, which generally refers to a deposition process thatforms material indiscriminately over various surfaces, such asdielectric surfaces, semiconductor surfaces, and metal surfaces. Forexample, polysilicon layer 52A is formed by CVD, HDPCVD, LPCVD, RTCVD,or ALD. Because of the high aspect ratio of isolation trench 30 (andthus narrow width of isolation trench 30), polysilicon material formedby the non-selective deposition process may fill or close (pinch) off atop of isolation trench 30 before completely filling isolation trench30, resulting in polysilicon layer 52A having a seam (void) 54A thatruns vertically through a center of polysilicon layer 52A afterdeposition. During subsequent processing, such as that associated withfabricating an IC device (e.g., a transistor) on SOI substrate 10,polysilicon DTI 50A (and thus polysilicon layer 52A) may be exposed tovarious high temperature processes, such as high temperature annealingprocesses. High temperatures (e.g., temperatures greater than about1000° C.) can cause thermal migration, growth, and/or recrystallizationof the silicon grains of polysilicon layer 52A, thereby changing a grainstructure of polysilicon layer 52A. For example, in FIG. 1, a grainstructure of polysilicon layer 52A changes during subsequent processing,resulting in polysilicon layer 52A having a void 56A, a void 56B, and avoid 56C. Void 56A, void 56B, and/or void 56B may have a dimension(e.g., width, length, or height) that is about 0.3 μm to about 0.5 μm.Voids 56A-56C can cause an IC device isolated by polysilicon DTI 50A toexhibit higher resistance than an IC device isolated by a polysiliconDTI having a polysilicon layer without such voids. The IC deviceisolated by polysilicon DTI 50A may thus exhibit increasedresistance-capacitance (RC) delay and decreased device reliability. Insome embodiments, a void may form at a top of polysilicon DTI 50A andfilled with metal during subsequent processing, which can diminishreliability of the IC device and/or cause an electrical short circuit.

Introducing dopants, such as boron, into the non-selectively depositedpolysilicon layer can reduce resistance and minimize effects of voids ina polysilicon DTI. For example, process B is similar to process A,except process B introduces dopants into the polysilicon material duringthe non-selective deposition process, such as p-type dopants (e.g.,boron, indium, other p-type dopant, or combinations thereof), n-typedopants (e.g., phosphorous, arsenic, other n-type dopant, orcombinations thereof), or combinations thereof. In FIG. 1, process Bintroduces boron into the polysilicon material, thereby forming aboron-doped polysilicon layer 52B. Polysilicon DTI 50B thus has oxidesidewall 40-1, oxide sidewall 40-2, and boron-doped polysilicon layer52B disposed between oxide sidewall 40-1 and oxide sidewall 40-2.Because of the high aspect ratio of isolation trench 30 and subsequenthigh temperature processing, polysilicon DTI 50B also includes a seam54B and voids 56D-56F, similar to seam 54A and voids 56A-56C,respectively, of polysilicon DTI 50A. Incorporating dopants intopolysilicon DTI 50B (i.e., boron-doped polysilicon layer 52B) can offsetor minimize resistance increases caused by voids 56D-56F. In someembodiments, an IC device isolated by polysilicon DTI 50B exhibits lessresistance than an IC device isolated by polysilicon DTI 50A. In someembodiments, incorporating boron into a polysilicon DTI can reduceresistance by as much as three times compared a polysilicon DTI withoutboron doping. However, as depicted in FIG. 1, outgassing (out-diffusion)of the boron dopants into ambient and/or unintended layers duringsubsequent processing can also undesirably alter IC devicecharacteristics.

Process C can reduce resistance and minimize effects of voids in apolysilicon DTI, while also minimizing dopant outgassing. Process C issimilar to process A and process B, except process C deposits aboron-doped polysilicon layer 52C over oxide layer 40, where boron-dopedpolysilicon layer 52C partially fills isolation trench 30, and thendeposits a polysilicon layer 52D over boron-doped polysilicon layer 52C,where polysilicon layer 52D fills a remainder of isolation trench 30.Boron-doped polysilicon layer 52C and polysilicon layer 52D are formedby non-selective deposition processes, such as described above.Polysilicon DTI 50C thus has oxide sidewall 40-1, oxide sidewall 40-2,and a bi-layer polysilicon layer (i.e., boron-doped polysilicon layer52C and polysilicon layer 52D) disposed between oxide sidewall 40-1 andoxide sidewall 40-2. Boron-doped polysilicon layer 52C separatespolysilicon layer 52D from oxide sidewall 40-1, oxide sidewall 40-2, andsemiconductor layer 16. In FIG. 1, boron-doped polysilicon layer 52C andpolysilicon layer 52D have substantially u-shaped profiles in an x-zplane. Because of the high aspect ratio of isolation trench 30 andsubsequent high temperature processing, polysilicon DTI 50C alsoincludes a seam 54C and voids 56G-56I, similar to seams 54A, 54B andvoids 56A-56C, 56D-56F, respectively, of polysilicon DTIs 50A, 50B.Incorporating dopants into polysilicon DTI 50C (i.e., boron-dopedpolysilicon layer 52C) can offset or minimize resistance increasescaused by voids 56G-56I, such that an IC device isolated by polysiliconDTI 50C exhibits less resistance than an IC device isolated bypolysilicon DTI 50A. The bi-layer polysilicon layer of polysilicon DTI50C can also exhibit less dopant outgassing compared to polysilicon DTI50B. However, as depicted in FIG. 1, some outgassing (out-diffusion) ofthe boron dopants into ambient and/or unintended layers duringsubsequent processing still occurs and can undesirably alter IC devicecharacteristics.

The present disclosure proposes a silicon-comprising DTI that addressesboth void issues and outgassing issues that arise from polysilicon DTIs50A-50C. Turning to FIG. 2, FIG. 2 depicts a fragmentary cross-sectionalview of fabrication of a silicon-comprising DTI 60, in portion orentirety, that can be integrated into an SOI substrate according tovarious aspects of the present disclosure. In FIG. 2, fabrication ofsilicon-comprising DTI 60 begins similar to fabrication of polysiliconDTIs 50A-50C. For example, fabrication includes forming patterning layer20 over SOI substrate 10, forming isolation trench 30 in SOI substrate10, depositing oxide layer 40 over SOI substrate 10 and patterning layer20 (where oxide layer 40 is disposed along sidewalls and bottom ofisolation trench 30 and oxide layer 40 partially fills isolation trench30), and removing oxide layer 40 from bottom 36 of isolation trench 30,such as described above. In contrast to fabrication of polysilicon DTIs50A-50C, fabrication of silicon-comprising DTI 60 proceeds according toa process D, where SOI substrate 10 having isolation trench 30 isreceived in a process chamber and a silicon layer 62 is formed inisolation trench 30. Silicon layer 62 includes monocrystalline silicon,which is also referred to as single crystalline silicon or crystallinesilicon. Monocrystalline silicon generally includes a single, continuoussilicon crystal having one crystal orientation and no grain boundaries,whereas polycrystalline silicon generally refers to multiple siliconcrystals (grains) separated by grain boundaries (i.e., grains ofmonocrystalline silicon, which can be oriented randomly and havedifferent crystal orientations). In some embodiments, silicon layer 62includes intrinsic crystalline silicon, which generally refers toundoped or unintentionally doped (UID) silicon. In such embodiments,silicon layer 62 is substantially free of dopants. In some embodiments,silicon layer 62 includes crystalline silicon doped with p-type dopants(e.g., boron, indium, other p-type dopant, or combinations thereof),n-type dopants (e.g., phosphorous, arsenic, other n-type dopant, orcombinations thereof), or combinations thereof. For example, siliconlayer 62 can include crystalline silicon doped with boron. In someembodiments, silicon layer 62 is a boron-doped silicon layer having aboron dopant concentration of about 1×10¹⁴ dopants/cm³ (cm⁻³) to about5×10²⁰ cm⁻³. In some embodiments, a dopant concentration, such as aboron concentration, is substantially the same along a thickness ofsilicon layer 62. In some embodiments, silicon layer 62 has a gradientdopant concentration, which can gradually increase or decrease along thethickness of silicon layer 62. In some embodiments, silicon layer 62includes discrete portions having different dopant concentrations, suchas a first silicon portion with a first dopant concentration and asecond silicon portion with a second dopant concentration that isdifferent than the first dopant concentration. It is noted that siliconlayer 62, whether comprised of intrinsic crystalline silicon or dopedcrystalline silicon, may include crystalline defects, such asdislocation (e.g., an irregularity and/or a disruption in the orderedarrangement of silicon atoms of monocrystalline silicon). A thickness ofsilicon layer 62 is less than a depth of isolation trench 30. In someembodiments, the thickness of silicon layer 62 is less than a sum of athickness of semiconductor layer 14 and insulator layer 12, such that atop surface of silicon layer 62 is below a top surface of SOI substrate10 (e.g., below a top surface of semiconductor layer 14). In someembodiments, the thickness of silicon layer 62 is about 6 μm to about 9μm.

Silicon layer 62 is formed by a selective, bottom-up deposition process.Bottom-up deposition process generally refers to a deposition processthat fills an opening from bottom to top (i.e., a bottom-up fill ofisolation trench 30). The selective, bottom-up deposition process avoidsunintentional filling of a top of isolation trench 30 before completelyfilling isolation trench 30 and thus avoids pinch-off issues that causeseams 54A-54C in polysilicon DTIs 50A-50C, respectively. For example, inFIG. 2, silicon layer 62 is seam-free. The bottom-up deposition processis a silicon selective epitaxial growth (SEG) process that selectivelydeposits (grows) silicon from semiconductor surfaces (e.g.,semiconductor layer 16 of SOI substrate 10) while limiting (orpreventing) growth of silicon from dielectric surfaces and/ornon-semiconductor surfaces (e.g., oxide layer 40). For example, silicongrows from semiconductor layer 16 but does not grow from oxide layer 40,such that silicon layer 62 fills a remainder of a bottom portion ofisolation trench 30 without covering a top surface of oxide layer 40and/or a top surface of patterning layer 20. In some embodiments, theSEG process is a selective CVD process that introduces asilicon-containing precursor and a carrier gas into the process chamber,where the silicon-containing precursor interacts with SOI substrate 10and oxide layer 40 to form silicon layer 62. The silicon-containingprecursor includes silane (SiH₄), disilane (Si₂H₆), dichlorosilane(SiH₂Cl₂) (DCS), trichlorosilane (SiHCl₃), silicon tetrachloride(SiCl₄), other suitable silicon-containing precursor, or combinationsthereof. The carrier gas may be an inert gas, such as ahydrogen-containing gas (e.g., H₂), an argon-containing gas (e.g., Ar),a helium-containing gas (e.g., He), a nitrogen-containing gas (e.g.,N₂), a xenon-containing gas, other suitable inert gas, or combinationsthereof. In the depicted embodiment, SOI substrate 10 and oxide layer 40are exposed to a deposition mixture that includes DCS(silicon-containing precursor) and H₂ (carrier gas). Though variousparameters of the selective CVD process can be adjusted (tuned) toensure that the silicon-containing precursor nucleates and growsselectively from and/or quicker from semiconductor layer 16 than oxidelayer 40, some silicon material may nucleate and grow on oxide layer 40.To prevent or limit such growth, the selective CVD process furtherintroduces an etchant-containing precursor into the process chamber thatcan interact with SOI substrate 10, oxide layer 40, and/or siliconmaterial deposited over SOI substrate 10 and/or oxide layer 40. Theetchant-containing precursor includes chlorine (Cl₂), hydrogen chloride(HCl), other etchant-containing precursor that can achieve desiredsilicon growth selectivity, or combinations thereof. Because growth ofthe silicon material on and from oxide layer 40, if any, is largelydiscontinuous and discrete compared to growth of silicon material on andfrom semiconductor layer 16, which is likely continuous and merged, theetchant-containing precursor can remove any silicon material from oxidelayer 40 faster than silicon material from semiconductor layer 16. Theselective CVD process thus simultaneously deposits and etches siliconmaterial but is configured to have a deposition rate that is greaterthan an etching rate to ensure net deposition of silicon material. Insome embodiments, the etchant-containing precursor prevents anynucleation of silicon material on oxide layer 40. In the depictedembodiment, the deposition mixture further includes HCl, which can etchsilicon material that nucleates on oxide layer 40 and/or prevent siliconmaterial from nucleating on oxide layer 40, thereby removing and/orpreventing growth of silicon material on oxide layer 40. In someembodiments, the selective CVD process further introduces adopant-containing precursor into the process chamber that can interactwith SOI substrate 10, oxide layer 40, and/or silicon material depositedover SOI substrate 10 and/or oxide layer 40. The dopant-containingprecursor includes boron (e.g., B₂H₆), phosphorous (e.g., PH₃), arsenic(e.g., AsH₃), other suitable dopant, or combinations thereof. Forexample, the deposition mixture can further include B₂H₆, whichfacilitates in-situ boron doping of silicon layer 62.

A target silicon growth (deposition) rate and/or silicon growthselectivity is achieved by adjusting (tuning) various parameters of theselective CVD process, such as a silicon-containing precursor flow rate,a carrier gas flow rate, an etchant-containing precursor flow rate, adopant-containing precursor flow rate, a temperature, a pressure, otherselective CVD process parameter, or combinations thereof. In someembodiments, the selective CVD process includes heating SOI substrate 10to a temperature that is about 800° C. to about 1,050° C. In someembodiments, a pressure maintained in the process chamber during theselective CVD process is about 10 Torr to about 100 Torr. In someembodiments, the selective CVD process is an LPCVD process, where apressure maintained in the process chamber is less than about 50 Torr.In some embodiments, a duration of the selective CVD process is about 5minutes to about 20 minutes. In some embodiments, parameters of theselective CVD process are tuned to achieve a silicon growth rate of atleast 1 μm/minute (i.e., silicon growth rate ≥1 μm/minute). In someembodiments, a flow rate of the silicon-containing precursor, such asDCS, is about 50 standard cubic centimeters per minute (sccm) to about200 sccm. In some embodiments, a flow rate of the carrier gas, such asH₂, is about 10,000 sccm to about 40,000 sccm. In some embodiments, aflow rate of the etchant-containing precursor, such as HCl, is about 200sccm to about 500 sccm. In some embodiments, a flow rate of thedopant-containing precursor, such as B₂H₆, is about 0.01 sccm to about 1sccm. In some embodiments, a flow rate of the dopant-containingprecursor is controlled to achieve different dopant concentrationprofiles in silicon layer 62, such as a substantially uniform dopantprofile along the thickness of silicon layer 62, a gradient dopantprofile (i.e., dopant increase or decreases) along the thickness ofsilicon layer 62, and/or discretely doped portions of silicon layer 62(e.g., a lightly-doped silicon portion and a heavily-doped siliconportion). In embodiments where multiple DTIs are concurrently formedacross a wafer, a thickness of a silicon layer formed in an isolationtrench may vary depending on a location of the isolation trench on thewafer. For example, a first thickness of a silicon layer formed in anisolation trench located at a center of a wafer may be greater than asecond thickness of a silicon layer formed in an isolation trenchlocated at an edge of the wafer. The present disclosure thus furthercontemplates tuning the selective CVD process to minimize variations insilicon layer thicknesses formed in isolation trenches across a wafer,thereby improving thickness uniformity. In some embodiments, apower/temperature ratio implemented during the selective CVD process istuned to improve thickness uniformity of silicon layers formed inisolation trenches across a wafer. For example, a centerpower/temperature is adjusted relative to an edge power/temperature toimprove thickness uniformity. In some embodiments, reducing the centerpower/temperature by about 5% relative to the edge power/temperatureachieves a center-to-edge thickness uniformity that is less than about20%. For example, a difference between the first thickness and thesecond thickness is less than about 20% when the centerpower/temperature is about 5% less than the edge power/temperature.

In some embodiments, a flow rate of the silicon-containing precursor(D), which dominates a deposition (growth) rate of the silicon material,and a flow rate of the etchant-containing precursor (E), which dominatesan etching rate of the silicon material, are tuned to enhance growthkinetics of silicon layer 62. For example, a ratio of theetchant-containing precursor and the silicon-containing precursor (E/Dratio) is tuned to minimize selectivity loss and prevent (or minimize)defects. In some embodiments, defects are silicon nuclei (i.e., siliconmaterial and/or particles) that form on oxide layer 40 during theselective CVD process. Since defect density is inversely proportional tothe E/D ratio (e.g., defect density decreases as E/D ratio increases), aflow rate of the etchant-containing precursor (e.g., HCl) can beincreased to minimize selectivity loss and/or limit defect density totolerable levels. For example, FIG. 3 provides a log-linear graph 70that correlates log defect density with an E/D ratio, where an E/D ratiois represented along an x-axis, a log defect level (in log-10 defectsper square centimeter of wafer area (cm²)) is represented along ay-axis, and a tolerable level of defect density is represented by line72. In the depicted embodiment, the tolerable level of defect density isless than or equal to about 100 (i.e., less than or equal to about 10defects per cm² of a wafer). In some embodiments, defect densities aboveline 72 indicate selectivity loss in a selective CVD process, meaningthat silicon material forms not only in trench areas (i.e., onsemiconductor layer 16 in isolation trench 30) but also in non-trenchareas (i.e., on the top surface of oxide layer 40), while defectdensities below line 72 indicate selectivity free in a selective CVDprocess, meaning that the silicon material forms only in trench areasand not in non-trench areas. In FIG. 3, a line 74 a and a line 74 brepresent log defect density as a function of the E/D ratio for a firstsilicon trench open ratio (i.e., a ratio of a trench area to a totalwafer area) and a second silicon trench open ratio, respectively, wherethe first silicon trench open ratio is greater than the second silicontrench open ratio. Lines 74 a, 74 b indicate that defect densitydecreases as the E/D ratio increases and defect density reachestolerable levels when the E/D ratio is greater than about 5. Lines 74 a,74 b also indicate that the E/D ratios needed to achieve tolerablelevels of defect densities increase as silicon trench open ratiosdecrease. The flow rate of the etchant-containing precursor in theselective CVD process can thus be increased relative to the flow rate ofthe silicon-containing precursor to increase the E/D ratio and optimizeselectivity (i.e., eliminate or minimize selectivity loss and ensuresilicon material growth from semiconductor layer 16 but not from oxidelayer 40) and minimize defects, but cannot be increased to a level thatcauses net etching effect. In some embodiments in FIG. 2, the E/D ratioof the selective CVD process is about 5 to about 10 (in other words,5≤E/D ratio≤10). E/D ratios less than 5 may result in siliconselectivity loss and/or unacceptable defect density levels, while E/Dratios greater than 10 may result in insufficient silicon growth fromsemiconductor layer 16 (and thus insufficient filling of isolationtrench 30) and/or unwanted etching of silicon material fromsemiconductor surfaces, such as semiconductor layer 16. In someembodiments, reducing defect density and selectivity loss can beachieved by reducing a temperature and pressure of the selective CVDprocess instead of, or in addition to, increasing the E/D ratio. In someembodiments, heating SOI substrate 10 to a temperature that is about800° C. to 1,050° C. and maintaining a pressure in the process chamberthat is about 10 Torr to about 100 Torr can achieve a silicon growthrate of at least 1 μm/minute and prevent defect density levels fromrising above 10 defects/cm².

Defects on surfaces of oxide layer 40 (e.g., native oxide or othercontaminates) can act as nucleation sites from which silicon materialcan undesirably grow during the silicon SEG process. In someembodiments, a cleaning process is performed before the silicon SEGprocess to remove defects from oxide layer 40 and/or silicon layer 16,such as any native oxide, contaminates, and/or other defects on oxidelayer 40 and/or silicon layer 16. The cleaning process is a bakingprocess performed in an etchant-comprising ambient, where defects areremoved (etched) from oxide layer 40 and/or silicon layer 16 during thebaking process. For example, the cleaning process can include heatingSOI substrate 10 to a cleaning temperature and introducing anetchant-containing precursor and a carrier gas into the process chamber.The etchant-containing precursor includes Cl₂, HCl, otheretchant-containing precursor that can remove defects, or combinationsthereof. The carrier gas includes an inert gas, such as ahydrogen-containing gas, an argon-containing gas, a helium-containinggas, a nitrogen-containing gas, a xenon-containing gas, other suitableinert gas, or combinations thereof. In the depicted embodiment, achlorine-based pre-baking process, such as an HCl pre-baking process, isperformed on oxide layer 40 to remove (clean) surface nucleation siteson oxide layer 40 before forming silicon layer 62. Decreasing surfacenucleation sites on oxide layer 40 can decrease defect densityassociated with forming silicon layer 62.

Process D then proceeds with forming a polysilicon layer 64 over siliconlayer 62 and oxide layer 40, where polysilicon layer 64 fills aremaining, upper portion of isolation trench 30. Polysilicon layer 64includes polycrystalline silicon, such as described herein. Polysiliconlayer 64 is undoped or unintentionally doped (i.e., polysilicon layer 64is substantially free of dopants, and in particular, substantially freeof boron dopants). In some embodiments, polysilicon layer 64 includespolysilicon doped with p-type dopants, n-type dopants, or combinationsthereof, but a region of polysilicon layer that will form a topmostsurface of silicon-comprising DTI 60 is substantially free of dopants.For example, polysilicon layer 64 can include an undoped polysiliconportion and a doped polycrystalline portion, where the undopedpolysilicon portion is located at a region of polysilicon layer 64 thatforms a topmost surface of silicon-comprising DTI 60. In someembodiments, the doped polysilicon portion includes boron-dopedpolysilicon. In some embodiments, the boron-doped polysilicon portionhas a boron dopant concentration of about 1×10¹⁵ cm⁻³ to about 5×10²⁰cm⁻³. In some embodiments, polysilicon layer 64 has a gradient boronconcentration that decreases from a first boron concentration at aninterface between silicon layer 62 and polysilicon layer 64 to a secondboron concentration at a top surface of polysilicon layer 64. In someembodiments, the gradient boron concentration decreases from about5×10²⁰ cm⁻³ to about 1×10¹⁷ cm⁻³. A thickness of polysilicon layer 64 isless than a thickness of silicon layer 62 and sufficient to fill aremainder of isolation trench 30. Any selectivity loss that occursduring formation of silicon layer 62 may result in particles (e.g.,silicon particles) forming on oxide layer 40. In some embodiments, theseparticles are very large, for example, having dimensions as large as 5μm to 7 μm. To prevent these particles from scratching wafer surfacesduring subsequent planarization processes, a thickness of polysiliconlayer 64 is sufficient to cover and inhibit movement of these particles.For example, the thickness of polysilicon layer 64 is about 0.5 μm toabout 3 μm to ensure coverage of any particles/contamination formedduring deposition of silicon layer 62.

Polysilicon layer 64 is formed by a non-selective, blanket depositionprocess, which generally refers to a deposition process that formsmaterial indiscriminately over various surfaces, such as dielectricsurfaces, semiconductor surfaces, and metal surfaces. For example,polysilicon layer 64 covers (blankets) all exposed surfaces, such as thetop surface of oxide layer 40 and top surface of silicon layer 62. Insome embodiments, the non-selective, blanket deposition process is ablanket CVD process that introduces a silicon-containing precursor and acarrier gas into the process chamber, where the silicon-containingprecursor interacts with oxide layer 40 and silicon layer 62 to deposita polysilicon material that forms polysilicon layer 64. The blanket CVDprocess does not introduce an etchant-containing precursor, such as HCl,into the process chamber. The silicon-containing precursor includesSiH₄, Si₂H₆, DCS, SiHCl₃, SiCl₄, other suitable silicon-containingprecursor, or combinations thereof. The carrier gas may be an inert gas,such as a hydrogen-containing gas, an argon-containing gas, ahelium-containing gas, a nitrogen-containing gas, a xenon-containinggas, other suitable inert gas, or combinations thereof. In the depictedembodiment, oxide layer 40 and silicon layer 62 are exposed to adeposition mixture that includes DCS (silicon-containing precursor) andH₂ (carrier gas). In some embodiments, the blanket CVD process furtherintroduces a dopant-containing precursor into the process chamber thatcan interact with oxide layer 40, silicon layer 62, and/or depositedpolysilicon material. The dopant-containing precursor includes boron,phosphorous, arsenic, other suitable dopant, or combinations thereof.For example, the deposition mixture can further include B₂H₆, whichfacilitates in-situ boron doping of polysilicon layer 64.

Various parameters of the non-selective, blanket deposition process,such as a silicon-containing precursor flow rate, a carrier gas flowrate, a dopant-containing precursor flow rate, a temperature, apressure, other selective CVD process parameter, or combinationsthereof. In some embodiments, the blanket CVD process includes heatingSOI substrate 10 to a temperature that is about 650° C. to about 1,000°C. In some embodiments, a pressure maintained in the process chamberduring the blanket CVD process is about 10 Torr to about 100 Torr. Insome embodiments, a duration of the selective CVD process is about 20minutes to about 50 minutes. In some embodiments, parameters of theblanket CVD process are tuned to achieve a polysilicon growth rate of atleast 0.1 μm/minute (i.e., polysilicon growth rate ≥2 μm/minute). Insome embodiments, a flow rate of the silicon-containing precursor, suchas DCS, is about 50 sccm to about 300 sccm. In some embodiments, a flowrate of the carrier gas, such as H₂, is about 10,000 sccm to about40,000 sccm. In some embodiments, a flow rate of the dopant-containingprecursor, such as B₂H₆, is about 0.01 sccm to about 1.0 sccm. In someembodiments, a flow rate of the dopant-containing precursor iscontrolled to achieve a dopant-free portion of polysilicon layer 64,such as a portion of polysilicon layer 64 that will form a top surface(or region) of silicon-comprising DTI 60. In some embodiments, a flowrate of the dopant-containing precursor is controlled to achieve agradient dopant concentration in polysilicon layer 64. For example, theflow rate of the dopant-containing precursor is reduced as a thicknessof polysilicon layer 64 increases. In some embodiments, the flow rate ofthe dopant-containing precursor is stopped before polysilicon layer 64reaches a target thickness.

Thereafter, a planarization process, such as CMP, is performed to removeportions of polysilicon layer 64, portions of oxide layer 40, andpatterning layer 22 from over the top surface of SOI substrate 10. Aremainder of polysilicon layer 64 forms a polysilicon capping layer 64′of silicon-comprising DTI 60, and a remainder of oxide layer 40 formsoxide sidewall 40-1 and oxide sidewall 40-2 of silicon-comprising DTI60. At least a top surface (or topmost region) of polysilicon cappinglayer 64 is substantially dopant-free so that polysilicon capping layer64 can function as a seal layer or a barrier layer that preventsdopants, such as boron, from outgassing during subsequent processing.For example, polysilicon capping layer 60 covers any dopant-containingportion of silicon-comprising DTI 60, such that silicon-comprising DTI60 does not have an exposed dopant-containing portion, such asboron-containing portion, like polysilicon DTIs 50A-50C. In someembodiments, a top surface of polysilicon capping layer 64′ and the topsurface of SOI substrate 10 are substantially planar after theplanarization process. In some embodiments, the planarization processincludes multiple steps, such as a first planarization that stops atoxide layer 40, a second planarization that stops at patterning layer22, and/or a third planarization that stops at the top surface of SOIsubstrate 10. In such embodiments, the first planarization may formpolysilicon capping layer 64′, while the second planarization and thethird planarization may reduce a thickness of polysilicon capping layer64′.

Silicon-comprising DTI 60 thus has oxide sidewall 40-1, oxide sidewall40-2, and a bi-layer silicon-comprising layer (i.e., silicon layer 62and polysilicon capping layer 64′) disposed between oxide sidewall 40-1and oxide sidewall 40-2. Silicon-comprising DTI 60 provides variousadvantages over polysilicon DTIs, such as polysilicon DTIs 50A-50C. Forexample, processes used for fabricating silicon-comprising DTI 60exhibit better gap-fill characteristics, particularly for high aspectratio isolation trenches, than processes used for fabricatingpolysilicon DTIs 50A-50C. Silicon-comprising DTI 60 can thus befabricated with no seams (or voids), which results in an IC deviceisolated by seam-free silicon-comprising DTI 60 exhibiting lowerresistance, and thus improved device reliability, than an IC deviceisolated by polysilicon DTIs 50A-50C. Even if silicon-comprising DTI 60has voids therein (which may result from a small seam), such voids aresignificantly smaller than voids 56A-56I present in polysilicon DTIs50A-50C and still provide an IC device that exhibits lower resistanceand improved device reliability. In another example, silicon-comprisingDTI 60 can incorporate dopants, such as boron, to reduce resistance ofan IC device but not exhibit outgassing during high temperature thermalprocesses. In particular, polysilicon capping layer 64′ prevents dopantfrom outgassing during subsequent processing, such as that associatedwith fabricating an IC device. Preventing dopant outgassing reducesdopant contamination. In some embodiments, polysilicon capping layer 64′prevents outgassing during high temperature annealing processes used tofabricate high voltage IC devices, such as annealing processes thatexpose a wafer to temperatures greater than about 1,000° C. to drive-indopants and form n-well and/or p-wells in an SOI substrate. In someembodiments, polysilicon capping layer 64′ prevents outgassing duringgate formation, such as gate dielectric formation. In yet anotherexample, forming polysilicon layer 64 after forming silicon layer 62reduces (and, in some embodiments, eliminates) scratching of wafersurfaces of a wafer in which silicon-comprising DTI 60 is incorporated,thereby preventing wafer damage during subsequent processing. Inparticular, because polysilicon layer 64 covers any particles (e.g.,silicon particles) that may form on oxide layer 40 resulting fromselectivity loss that occurs during formation of silicon layer 62,polysilicon layer 64 prevents such particles from freely moving duringsubsequent planarization processes, thereby preventing (or limiting)particles from scratching and/or causing other damage to wafer surfacesduring the planarization processes. Different embodiments may havedifferent advantages, and no particular advantage is required of anyembodiment.

Silicon layer 62 and polysilicon layer 64 are formed in isolation trench30 “in-situ.” For example, the selective CVD process and the blanket CVDprocess are performed within the same process chamber, such as a processchamber of a CVD tool, such that a wafer (e.g., SOI substrate 10 and thevarious layers and/or features fabricated thereon) remain under vacuumconditions. As such, “in-situ” also generally refers to performingvarious processes on a wafer without exposing the wafer to an externalambient (for example, external to an IC processing system), such asoxygen. Performing the selective CVD and the blanket CVD process canthus minimize (or eliminate) exposure to oxygen and/or other externalambient during processing. In some embodiments, the cleaning process isalso performed in-situ with the selective CVD process and the blanketCVD process. In some embodiments, a purging process at various stages offorming silicon layer 62 and polysilicon layer 64, such as beforeperforming the selective CVD process and before the blanket CVD process.The purge process can remove any byproducts from the process chamber.The purge process introduces an inert gas into the process chamber toremove any byproducts from the process chamber, such as ahydrogen-containing gas, a nitrogen-containing gas, an argon-containinggas, a helium-containing gas, other suitable inert gas, or combinationsthereof. In some embodiments, processing proceeds from the selective CVDprocess to the blanket CVD deposition process by adjusting a depositionmixture supplied to a process chamber. For example, anetchant-containing precursor is removed from the deposition mixture toswitch from the selective CVD process to the blanket CVD process.

FIG. 4A is a fragmentary top view of an IC device 100, in portion orentirety, according to various aspects of the present disclosure. FIG.4B is a fragmentary cross-sectional view of IC device 100 taken alongline B-B of FIG. 4A, in portion or entirety, according to variousaspects of the present disclosure. IC device 100 has asemiconductor-on-insulator (SOI) substrate 105 and an isolation feature110 disposed in SOI substrate 105, where isolation feature 110 surroundsan active region 115 of IC device 100. Active region 115 (also referredto as an OD region) is configured for a transistor and can be referredto as a transistor region. In some embodiments, high voltage devices,such as a high voltage transistor, are fabricated on SOI substrate 105in active region 115. High voltage devices operate at high voltages,such as transistors that operate at voltages greater than about 100 V.Process for fabricating high voltage devices often include hightemperature thermal processes, some of which may expose the high voltagedevices to temperatures greater than about 60° C. IC device 100 includesan isolation structure, described below and herein, that can withstandsuch high temperature thermal processes and improve performance,integrity, and/or reliability of high voltage devices, such as highvoltage transistors. In some embodiments, FIG. 4A and FIG. 4B have beensimplified for the sake of clarity to better understand the inventiveconcepts of the present disclosure. Additional features can be added inIC device 100, and some of the features described below can be replaced,modified, or eliminated in other embodiments of IC device 100.

SOI substrate 105 includes a semiconductor layer 120, an insulator layer122, and a semiconductor layer 124, where insulator layer 122 isdisposed between and separates semiconductor layer 120 and semiconductorlayer 124. Insulator layer 122 electrically isolates semiconductor layer120 from semiconductor layer 124. Semiconductor layer 120 andsemiconductor layer 124 include a semiconductor material, and insulatorlayer 122 includes a dielectric material. The semiconductor material caninclude silicon, germanium, silicon germanium, silicon carbide, galliumarsenide, gallium phosphide, indium phosphide, indium arsenide, indiumantimonide, GaAsP, AlInAs, AlGaAs, GalnAs, GaInP, GaInAsP, othersuitable semiconductor materials, or combinations thereof. Thedielectric material can include silicon, oxygen, nitrogen, carbon, othersuitable isolation constituent, or combinations thereof. In the depictedembodiment, semiconductor layer 120 and semiconductor layer 124 includethe same semiconductor material, such as silicon, and the insulatorlayer 122 includes oxygen. In such embodiments, semiconductor layers120, 124 can be referred to as silicon layers, insulator layer 122 canbe referred to as an oxide layer, and SOI substrate 105 can be referredto as a silicon-on-insulator substrate. In some embodiments,semiconductor layer 120 and semiconductor layer 124 include differentsemiconductor material. In some embodiments, SOI substrate 105 is asilicon germanium-on-insulator (SGOI) substrate. In some embodiments,SOI substrate 105 is a germanium-on-insulator (GOI) substrate. SOIsubstrate 105 can be fabricated using separation by implantation ofoxygen (SIMOX), wafer bonding, and/or other suitable methods. SOIsubstrate 105 can include various doped regions depending on designrequirements of IC device 100. For example, SOI substrate 105 caninclude p-type doped regions (referred to as a p-well), n-type dopedregions (referred to as an n-well), or combinations thereof. N-typedoped regions are doped with n-type dopants, such as phosphorus,arsenic, other n-type dopant, or combinations thereof. P-type dopedregions are doped with p-type dopants, such as boron, indium, otherp-type dopant, or combinations thereof. In some embodiments, SOIsubstrate 105 includes doped regions formed with a combination of p-typedopants and n-type dopants.

Isolation feature 110 surrounds and electrically isolates active region115 from other active regions and/or passive regions of IC device 100.In FIG. 4B, isolation feature 110 is disposed in SOI substrate 105 andsurrounds active region 115, such that isolation feature 110 can bereferred to as an isolation ring. Isolation feature 110 can have anysuitable configuration and can include different structures, such asshallow trench isolation (STI) structures, deep trench isolation (DTI)structures, local oxidation of silicon (LOCOS) structures, othersuitable isolation structures, or combinations thereof. In someembodiments, STI structures generally have a depth that is less than athickness of semiconductor layer 124, while DTI structures generallyhave a depth that is equal to or greater than semiconductor layer 124,such that DTI structures extend at least to insulator layer 122. In someembodiments, STI structures have a depth that is less than about 0.5 μm,while DTI structures have a depth that is greater than about 5 μm. Inthe depicted embodiment, isolation feature 110 includes an STI structure130 and a DTI structure 135, each of which surrounds active region 115and can be referred to as an STI ring and a DTI ring, respectively. STIstructure 130 has a width w1 and a depth d1. DTI structure 135 has awidth w2 and a depth d2, where width w2 is less than width w1 and depthd2 is greater than depth d1. In some embodiments, width w1 is about 0.3μm to about 3 μm. In some embodiments, width w2 is about 0.1 μm to about1 μm. In some embodiments, depth d1 is about 0.5 μm to about 3 μm. Insome embodiments, depth d2 is about 1 μm to about 50 μm. In FIG. 4B,width w1 and width w2 are defined along the x-direction betweensidewalls of STI structure 130 and DTI structure 135, respectively, anddepth d1 and depth d2 are defined along the z-direction between a topsurface of semiconductor layer 124 and a bottom of STI structure 130 andDTI structure 135, respectively. DTI structure 135 extends through STIstructure 130, such that DTI structure 135 is disposed between a firstportion of STI structure 130 having a width w3 and a second portion ofSTI structure 130 having a width w4. In some embodiments, width w3 isabout 0.1 μm to about 1 μm, and width w4 is about 0.1 μm to about 1 μm.In the depicted embodiment, a center of DTI structure 135 is alignedwith a center of STI structure 130, such that width w3 is about equal towidth w4. In some embodiments, the center of DTI structure 135 is notaligned with the center of STI structure 130, such that width w3 isdifferent than width w4. In some embodiments, a sidewall of DTIstructure 135 is aligned with a sidewall of STI structure 130, such thatSTI structure 130 is not divided into a first portion and a secondportion as depicted. In such embodiments, STI structure 130 is disposedbetween and separates active region 115 and DTI structure 135 or DTIstructure 135 is disposed between and separates active region 115 andSTI structure 130 depending on sidewall alignment.

STI structure 130 includes silicon oxide, silicon nitride, siliconoxynitride, other suitable isolation material (for example, includingsilicon, oxygen, nitrogen, carbon, or other suitable isolationconstituent), or combinations thereof. STI structure 130 can be formedby forming a patterned mask layer over SOI substrate 105, where thepatterned mask layer 105 has an opening therein that exposessemiconductor layer 124 of SOI substrate 105; etching a trench insemiconductor layer 124 using the patterned mask layer as an etch mask(for example, by using a dry etching process and/or a wet etchingprocess); and depositing an insulator material that fills the trench(for example, by a chemical vapor deposition (CVD) process or a spin-onglass process). A chemical mechanical polishing (CMP) process may beperformed to remove excess insulator material, such as insulatormaterial disposed over the top surface of semiconductor layer 124,and/or planarize a top surface of STI structure 130 and/or the topsurface of semiconductor layer 124. In another example, where SOIsubstrate 105 is patterned to have various fins (e.g., active region 115being one of the fins formed from semiconductor layer 124), STIstructure 130 can be formed by depositing an insulator material afterforming the fins and etching back the insulator material to form STIstructure 130. In such embodiments, the insulator material can fill gaps(trenches) between the fins. In some embodiments, STI structure 130includes a multi-layer structure that fills the trenches, such as asilicon oxide layer disposed over a silicon nitride liner and/or anoxide liner. In another example, STI structure 130 includes a dielectriclayer disposed over a doped liner layer (including, for example, boronsilicate glass (BSG) or phosphosilicate glass (PSG)). In yet anotherexample, STI structure 130 includes a bulk dielectric layer disposedover a dielectric liner. In some embodiments, STI structure 130 isformed by a flowable CVD (FCVD) process that includes, for example,depositing a flowable material (such as a liquid compound) over SOIsubstrate 105 and converting the flowable material into a solid materialby a suitable technique, such as thermal annealing and/or ultravioletradiation treatment. In some embodiments, STI structure 130 is formed bya high-density plasma (HDP) process and/or a high aspect ratiodeposition (HARP) process.

DTI structure 135 extends through SOI substrate 105 to at leastinsulator layer 122. In some embodiments, DTI structure 135 is a highaspect ratio isolation structure, which generally refers to an isolationstructure having a ratio of a depth to a width (D/W) that is greaterthan about 5. For example, a ratio of depth d2 to width w2 (d2/w2) isabout 5 to about 50. In FIG. 4B, DTI structure 135 extends completelythrough semiconductor layer 124 and insulator layer 122 to semiconductorlayer 120 (in particular, to a top surface of semiconductor layer 122).Depth d2 is thus equal to a sum of a thickness of semiconductor layer124 and a thickness of insulator layer 122. In some embodiments, depthd2 is greater than the sum of the thickness of semiconductor layer 124and the thickness of insulator layer 122, such that DTI structure 135extends completely through semiconductor layer 124 and insulator layer122 and partially through semiconductor layer 120. In some embodiments,depth d2 is equal to a sum of the thickness of semiconductor layer 124,the thickness of insulator layer 122, and a thickness of semiconductorlayer 120, such that DTI structure 135 extends completely through SOIsubstrate 105 (i.e., completely through semiconductor layer 124,insulator layer 122, and semiconductor layer 120). In some embodiments,depth d2 is less than a thickness of semiconductor layer 124, such thatDTI structure extends partially through semiconductor layer 124. In someembodiments, depth d2 is equal to a thickness of semiconductor layer124, such that DTI structure 135 extends completely throughsemiconductor layer 124 to a top surface of insulator layer 122. In someembodiments, depth d2 is greater than the thickness of semiconductorlayer 124 and less than the sum of the thickness of semiconductor layer124 and the thickness of insulator layer 122, such that DTI structure135 extends completely through semiconductor layer 124 and partiallythrough insulator layer 122.

DTI structure 135 includes an oxide DTI portion 140A and a multilayersilicon-comprising DTI portion 140B, each of which surrounds activeregion 115. In some embodiments, oxide DTI portion 140A is referred toas an oxide ring and multilayer silicon-comprising DTI portion 140B isreferred to as a multilayer silicon-comprising ring. In FIG. 4A and FIG.4B, active region 115 is surrounded by a single ring isolationstructure, a single ring STI structure, and a single ring DTI structure.In some embodiments, active region 115 is surrounded by a multi-ring DTIstructure, such as depicted in FIG. 9, which includes two multilayersilicon-comprising rings surrounding active region 115. Oxide DTIportion 140A lines sidewalls of DTI structure 135 and can thus bereferred to as an oxide liner. In FIG. 4B, oxide DTI portion 140Aincludes an oxide layer 142 and an oxide layer 144. Oxide layer 142 isdisposed between and separates a first sidewall of multilayersilicon-comprising DTI portion 140B and SOI substrate 105 (for example,semiconductor layer 124 and insulator layer 122), and oxide layer 144 isdisposed between and separates a second sidewall of multilayersilicon-comprising DTI portion 140B and SOI substrate 105. Oxide layer142 and oxide layer 144 are also respectively disposed between the firstsidewall and the second sidewall of multilayer silicon-comprising DTIportion 140B and STI structure 130. In some embodiments, oxide layer 142and oxide layer 144 represent portions of a single, continuous oxidelayer that wraps/surrounds multilayer silicon-comprising DTI portion140B. Oxide layer 142 has a thickness t1 and oxide layer 144 has athickness t2. Thickness t1 and thickness t2 are defined along thex-direction between a respective sidewall of DTI structure 135 and arespective sidewall of multilayer silicon-comprising DTI portion 140B.In the depicted embodiment, thickness t1 is about equal to thickness t2.In some embodiments, thickness t1 is different than thickness t2depending on alignment of DTI structure 135 and STI structure 130. Oxidelayer 142 has a length defined along the z-direction and oxide layer 144has a length along the z-direction, where the length of oxide layer 142and the length of oxide layer 144 are equal to about depth d2. Thicknesst1 and thickness t2 are defined along the x-direction between arespective sidewall of DTI structure 135 and a respective sidewall ofmultilayer silicon-comprising DTI portion 140B. Oxide layers 142, 144include a dielectric material having oxygen in combination with anotherchemical element, such as silicon, nitrogen, carbon, other suitableelectrical isolation constituent, or combinations thereof. For example,oxide layers 142, 144 each include oxygen and silicon and can bereferred to as silicon oxide liners.

Multilayer silicon-comprising DTI portion 140B includes two layers—asilicon layer 146 and a polysilicon capping layer 148—and can bereferred to as a bi-layer silicon-comprising DTI structure. Siliconlayer 146 and polysilicon capping layer 148 each extend continuous anduninterrupted along the x-direction from oxide layer 142 to oxide layer144 to form a bottom portion and a top portion, respectively, ofmultilayer silicon-comprising DTI portion 140B. Silicon layer 146 andpolysilicon capping layer 148 are similar to silicon layer 62 andpolysilicon layer 64, respectively, described above. For example,silicon layer 146 includes monocrystalline silicon and polysiliconcapping layer 148 includes polycrystalline silicon. In the depictedembodiment, silicon layer 146 includes intrinsic, undoped crystallinesilicon (i.e., silicon layer 146 is substantially free of dopants) orsilicon layer 146 includes crystalline silicon doped with p-typedopants, n-type dopants, or combinations thereof. In some embodiments,silicon layer 146 is a boron-doped silicon layer having a boron dopantconcentration of about 1×10¹⁴ cm⁻³ to about 1×10²⁰ cm⁻³. In the depictedembodiment, polysilicon capping layer 148 is undoped or unintentionallydoped. In other words, polysilicon capping layer 148 is substantiallyfree of dopants, and in particular, substantially free of boron dopants.Silicon layer 146 has a thickness t3 defined along the z-direction, andpolysilicon capping layer 148 has a thickness t4 defined along thez-direction. Thickness t4 is less than thickness t3 and less than depthd1. In some embodiments, thickness t3 is about 6 μm to about 8 μm. Insome embodiments, thickness t4 is less than about 2 μm. For example,thickness t4 is about 0.5 μm to about 1 μm. In FIG. 4B, multilayersilicon-comprising DTI portion 140B has a width w5 that is substantiallyuniform along depth d2. In some embodiments, width w5 is about 0.1 μm toabout 1 μm. In such embodiments, silicon layer 146 and polysiliconcapping layer 148 each have substantially uniform widths (e.g., widthw5) along thickness t3 and thickness t4, respectively.

A transistor 150 is fabricated in active region 115. In the depictedembodiment, transistor 150 is a high voltage transistor that operates athigh voltages. Transistor 150 includes a p-well 152 and an n-well 154disposed in semiconductor layer 124 of SOI substrate 105, various dopedregions disposed in p-well 152 (e.g., a p-doped region 160 and ann-doped region 162), various doped regions disposed in n-well 154 (e.g.,n-doped region 164), and a gate 170 (including, for example, a gatedielectric 172 and a gate electrode 174). Additional isolationstructures may be disposed in active region 115 to separate and isolatedevice features, such as an STI structure 180 disposed in p-well 152 andan STI structure 182 disposed in n-well 154. STI isolation structure 130extends into and is partially disposed in p-well 152 and n-well 154,where p-doped region 160 is disposed between STI structure 130 and STIstructure 180, n-doped region 164 is disposed between STI structure 130and STI structure 182, and STI structure 180 is disposed between p-dopedregion 160 and n-doped region 162. In some embodiments, gate 170 isdisposed between a source region and a drain region of transistor 150,where a channel region is formed in semiconductor layer 124 of SOIsubstrate 110 between the source region and the drain region. Gate 170engages the channel region, such that current can flow between thesource region and the drain region (collectively referred to assource/drain regions) during operation. In some embodiments, gate 170further includes gate spacers disposed along sidewalls of gatedielectric 172 and gate electrode 174. In some embodiments, contacts aredisposed on p-doped region 160, n-doped region 162, and/or n-dopedregion 164.

FIG. 5 is a diagrammatic cross-sectional view of an IC device 200, inportion or entirety, according to various aspects of the presentdisclosure. For clarity and simplicity, similar features of IC device100 in FIG. 4A and FIG. 4B and IC device 200 in FIG. 5 are identified bythe same reference numerals. For example, IC device 200 includesisolation feature 110 disposed in and surrounding active region 115 ofSOI substrate 105, where isolation feature 110 includes STI structure130 and DTI structure 135. In contrast to IC device 100, DTI structure135 has oxide DTI portion 140A and a multilayer silicon-comprising DTIportion 240B. Multilayer polysilicon DTI portion 240B has a bi-layer DTIstructure similar to multilayer silicon-comprising portion 140B, such asa silicon layer 246 and a polysilicon capping layer 248 disposed oversilicon layer 246. Silicon layer 246 is similar to silicon layer 146described above, and in the depicted embodiment, is a boron-dopedsilicon layer. Polysilicon capping layer 248 is similar to polysiliconcapping layer 148 described above, except polysilicon capping layer 248has a gradient boron dopant concentration that decreases from a firstboron concentration at an interface between silicon layer 246 andpolysilicon capping layer 248 to a second boron concentration at topsurface of polysilicon capping layer 248. In some embodiments, thesecond boron concentration is zero (or substantially zero). In someembodiments, the second boron concentration is less than or equal toabout 1×10¹⁷ cm⁻³, which is sufficiently low enough to consider a topsurface (or topmost region of polysilicon layer 248) as undoped andavoid outgas sing of boron during subsequent processing. In someembodiments, the first dopant concentration is about 6×10¹⁸ cm⁻³. InFIG. 5, silicon layer 246 has a thickness t5 that is less than thicknesst3 and polysilicon capping layer 248 has a thickness t6 that is greaterthan thickness t4. In some embodiments, thickness t5 is about 4 μm toabout 7 μm, and thickness t6 is about 1 μm to about 6 μm. In someembodiments, silicon layer 246 and polysilicon capping layer 248 havethickness t3 and thickness t4. In some embodiments, such as depicted,silicon layer 246 has a substantially uniform boron concentration alongits thickness t6, such as the first dopant concentration along itsthickness t6. FIG. 5 has been simplified for the sake of clarity tobetter understand the inventive concepts of the present disclosure.Additional features can be added in IC device 200, and some of thefeatures described below can be replaced, modified, or eliminated inother embodiments of IC device 200.

FIG. 6 is a diagrammatic cross-sectional view of an IC device 200, inportion or entirety, according to various aspects of the presentdisclosure. For clarity and simplicity, similar features of IC device100 in FIG. 4A and FIG. 4B and IC device 300 in FIG. 6 are identified bythe same reference numerals. For example, IC device 300 includesisolation feature 110 disposed in and surrounding active region 115 ofSOI substrate 105, where isolation feature 110 includes STI structure130 and DTI structure 135. In contrast to IC device 100, DTI structure135 has oxide DTI portion 140A and a multilayer silicon-comprising DTIportion 340B. Multilayer silicon-comprising DTI portion 340B has atri-layer DTI structure, instead of a bi-layer structure like DTIportion 140B like multilayer silicon-comprising portion 140B. Forexample, multilayer silicon-comprising DTI portion 340B has a bi-layersilicon layer 346 and a polysilicon capping layer 348. Bi-layer siliconlayer 346 includes a silicon layer 346A having a first boronconcentration and a silicon layer 346B having a second boronconcentration, where silicon layer 346B is disposed between siliconlayer 346A and polysilicon capping layer 348 and the first boronconcentration is greater than the second boron concentration. In someembodiments, silicon layer 346A and silicon layer 346B can be referredto as a heavily doped silicon layer and a lightly doped silicon layer,respectively. Polysilicon capping layer 348 is similar to polysiliconcapping layer 148 described above. In the depicted embodiment,polysilicon capping layer 348 is an undoped polysilicon layer. Siliconlayer 346A has a thickness t7, silicon layer 346B has a thickness t8,and a sum of thickness t7 and thickness t8 is equal to thickness t3. Insome embodiments, thickness t7 is about 4 μm to about 7 μm. In someembodiments, thickness t8 is about 0.2 μm to about 2 μm. FIG. 3 has beensimplified for the sake of clarity to better understand the inventiveconcepts of the present disclosure. Additional features can be added inIC device 300, and some of the features described below can be replaced,modified, or eliminated in other embodiments of IC device 300.

FIG. 7 is a diagrammatic cross-sectional view of an IC device 400, inportion or entirety, according to various aspects of the presentdisclosure. For clarity and simplicity, similar features of IC device100 in FIG. 4A and FIG. 4B and IC device 400 in FIG. 7 are identified bythe same reference numerals. For example, IC device 400 includesisolation feature 110 is disposed in and surrounding active region 115of SOI substrate 105. Isolation feature 110 is adjacent to and contactsactive region 115. Isolation feature 110 includes STI structure 130 andDTI structure 135. In contrast to IC device 100, DTI structure 135 hasoxide DTI portion 140A and a multilayer silicon-comprising DTI portion440B. Multilayer silicon-comprising DTI portion 440B has a bi-layer DTIstructure similar to multilayer silicon-comprising portion 140B, excepta profile of multilayer silicon-comprising DTI portion 440B is differentthan a profile of multilayer silicon-comprising portion 140B. Forexample, multilayer silicon-comprising DTI portion 440B includes asilicon layer 446 and a polysilicon capping layer 448 that are similarto silicon layer 146 and polysilicon capping layer 148 (e.g., undoped)or polysilicon capping layer 248 (e.g., gradient dopant concentration),respectively, as described above, but a width of multilayersilicon-comprising portion DTI portion 240B varies along depth d2 of DTIstructure 135 instead of being substantially uniform along depth d2 likemultilayer silicon-comprising DTI portion 140B. For example, multilayersilicon-comprising DTI portion 440B is divided into a top end T, abottom end B, and a middle M disposed between top end T and bottom endB. Middle has a thickness 9 and a substantially uniform width along itsthickness t9, such as width w5. Top end T has a thickness t10, where awidth of top end T decreases from a width w6 to width w5 along thicknesst10. Bottom end B has a thickness t11, where a width of bottom end Bdecreases from width w5 to a width w7 along thickness t11. Multilayersilicon-comprising DTI portion 440B thus has a wider top end (portion)and a narrower bottom end (portion). In FIG. 7, polysilicon cappinglayer 448 and a portion of silicon layer 446 form top end T. In suchembodiments, silicon layer 446 has a middle disposed between taperedends. In some embodiments, only polysilicon capping layer 448 forms topend T. FIG. 7 has been simplified for the sake of clarity to betterunderstand the inventive concepts of the present disclosure. Additionalfeatures can be added in IC device 400, and some of the featuresdescribed below can be replaced, modified, or eliminated in otherembodiments of IC device 400.

FIG. 8 is a diagrammatic cross-sectional view of an IC device 500, inportion or entirety, according to various aspects of the presentdisclosure. For clarity and simplicity, similar features of IC device100 in FIG. 4A and FIG. 4B and IC device 800 in FIG. 8 are identified bythe same reference numerals. For example, IC device 500 includesisolation feature 110 disposed in and surrounding active region 115 ofSOI substrate 105, where isolation feature 110 includes STI structure130 and DTI structure 135. In contrast to IC device 100, DTI structure135 has oxide DTI portion 140A and a multilayer silicon-comprising DTIportion 540B. Multilayer silicon-comprising DTI portion 540B has atri-layer DTI structure similar to multilayer silicon-comprising portion340B of IC device 300, except a profile of multilayer silicon-comprisingDTI portion 540B is different than a profile of multilayersilicon-comprising portion 340B. For example, multilayersilicon-comprising DTI portion 540B has a bi-layer silicon layer 546(for example, a silicon layer 546A and a silicon layer 546B) and apolysilicon capping layer 548. Silicon layer 546A, silicon layer 546B,and polysilicon capping layer 548 are similar to silicon layer 346A,silicon layer 346B, and polysilicon capping layer 348, respectively, asdescribed above, but a width of multilayer silicon-comprising portionDTI portion 540B varies along depth d2 of DTI structure 135 instead ofbeing substantially uniform along depth d2 like multilayersilicon-comprising DTI portion 340B. For example, in FIG. 8, multilayersilicon-comprising DTI portion 540B is divided into a top end T, abottom end B, and a middle M disposed between top end T and bottom endB, which are similar to top end T, bottom end B, and middle M ofmultilayer silicon-comprising DTI 440B described above. Multilayersilicon-comprising DTI portion 540B thus has a wider top end (portion)and a narrower bottom end (portion). In the depicted embodiment,polysilicon capping layer 548 and a first portion of silicon layer 546Bform top end T, a second portion of silicon layer 546B and a firstportion of silicon layer 546A form middle, and a second portion ofsilicon layer 546A forms bottom end B. In such embodiments, siliconlayer 546B and silicon layer 5456B each have a tapered width portion anda substantially uniform width portion. In some embodiments, onlypolysilicon capping layer 548 forms top end T. In some embodiments,polysilicon capping layer 548, silicon layer 546A, and silicon layer546B form top end T. FIG. 8 has been simplified for the sake of clarityto better understand the inventive concepts of the present disclosure.Additional features can be added in IC device 500, and some of thefeatures described below can be replaced, modified, or eliminated inother embodiments of IC device 500.

IC device 100, IC device 200, IC device 300, IC device 400, IC device500, and/or IC device 600 may be included in a microprocessor, a memory,and/or other IC device. In some embodiments, IC device 100, IC device200, IC device 300, IC device 400, IC device 500, and/or IC device 600may be a portion of an IC chip, an SoC, or portion thereof, thatincludes various passive and active microelectronic devices such asresistors, capacitors, inductors, diodes, PFETs, NFETs, MOSFETs, CMOStransistors, BJTs, LDMOS transistors, high voltage transistors, highfrequency transistors, other suitable components, or combinationsthereof.

The present disclosure provides for many different embodiments. Deeptrench isolation structures for high voltage semiconductor-on-insulatordevices are disclosed herein. An exemplary deep trench isolationstructure surrounds an active region of a semiconductor-on-insulatorsubstrate. The deep trench isolation structure includes a firstinsulator sidewall spacer, a second insulator sidewall spacer, and amultilayer silicon-comprising isolation structure disposed between thefirst insulator sidewall spacer and the second insulator sidewallspacer. The multilayer silicon-comprising isolation structure includes atop polysilicon portion disposed over a bottom silicon portion. Thebottom polysilicon portion is formed by a selective deposition process,while the top polysilicon portion is formed by a non-selectivedeposition process.

In some embodiments, the semiconductor-on-insulator substrate includes afirst semiconductor layer, a second semiconductor layer disposed overthe first semiconductor layer, and an insulator layer disposed betweenthe first semiconductor layer and the second semiconductor layer. Insuch embodiments, the isolation structure extends through the secondsemiconductor layer and the insulator layer of thesemiconductor-on-insulator substrate to the first semiconductor layer ofthe semiconductor-on-insulator substrate. In some embodiments, the toppolysilicon portion has a first thickness, the bottom silicon portionhas a second thickness, a sum of the first thickness and the secondthickness is equal to a depth of the isolation structure in thesemiconductor-on-insulator substrate, and the second thickness isgreater than the first thickness. In some embodiments, the bottomsilicon portion includes dopants, such as boron, and the top polysiliconportion is free of dopants. In some embodiments, the bottom siliconportion includes a first silicon layer and a second silicon layer, thefirst silicon layer has a first dopant concentration, the second siliconlayer has a second dopant concentration, the first silicon layer isdisposed between the top polysilicon portion and the second siliconlayer, and the first dopant concentration is less than the second dopantconcentration. In some embodiments, the top polysilicon portion has agradient dopant concentration that decreases from a first dopantconcentration at an interface of the top polysilicon portion and thebottom silicon portion to a second dopant concentration at a top surfaceof the top polysilicon portion. In such embodiments, a topmost surfaceof the top polysilicon portion may be substantially dopant free. In someembodiments, the top polysilicon portion has a tapered width. In someembodiments, the bottom silicon portion has a first portion having afirst tapered width, a second portion having a substantially uniformwidth, and a third portion having a second tapered width, wherein thesecond portion is disposed between the first portion and the secondportion.

An exemplary device includes a silicon-on-insulator substrate having afirst silicon layer, an insulator layer disposed over the first siliconlayer, and a second silicon layer disposed over the insulator layer. Thedevice further includes a first isolation structure and a secondisolation structure disposed in the silicon-on-insulator substrate. Thefirst isolation structure extends to a first depth in thesilicon-on-insulator substrate, and the second isolation structureextends through the first isolation structure to a second depth in thesilicon-on-insulator substrate that is greater than the first depth. Thesecond isolation structure includes a polysilicon capping layer disposedover a silicon layer. A sum of a first thickness of the polysiliconcapping layer and a second thickness of the silicon layer is equal tothe second depth of the second isolation structure. In some embodiments,the second isolation structure further includes an oxide layer thatseparates first sidewalls of the polysilicon capping layer from thefirst isolation structure and further separates second sidewalls of thesilicon layer from the first isolation structure and thesilicon-on-insulator substrate. In some embodiments, a length of theoxide layer is equal to the second depth of the second isolationstructure.

In some embodiments, the first thickness of the polysilicon cappinglayer is less than the first depth of the first isolation structure. Insome embodiments, the first isolation structure and the second isolationstructure form an isolation ring that surrounds an active region of thesilicon-on-insulator substrate. A device may be disposed in the activeregion. In some embodiments, the second isolation structure physicallycontacts the second silicon layer of the silicon-on-insulator substrate.In some embodiments, a top end of the second isolation structure iswider than a bottom end of the second isolation structure. In someembodiments, the silicon layer is a boron-doped silicon layer and thepolysilicon capping layer is free of boron.

An exemplary method includes receiving a semiconductor-on-insulatorsubstrate that includes a first semiconductor layer, an insulator layerdisposed over the first semiconductor layer, and a second semiconductorlayer disposed over the insulator layer. The method further includesforming an isolation trench in the semiconductor-on-insulator substrate.The isolation trench extends through the second semiconductor layer andthe insulator layer to expose the second semiconductor layer of thesemiconductor-on-insulator substrate. The method further includesperforming a selective deposition process to form a silicon layer thatfills a bottom portion of the isolation trench and performing anon-selective deposition process to form a polysilicon layer that fillsa top portion of the isolation trench. In some embodiments, theselective deposition process and the non-selective deposition processare formed in-situ. In some embodiments, performing the selectivedeposition process includes using a silicon-containing precursor and anetchant-containing precursor and performing the non-selective depositionprocess includes using the silicon-containing precursor but not theetchant-containing precursor. In some embodiments, the insulator layeris a first insulator layer and the method can further include forming asecond insulator layer along sidewalls of the isolation trench beforeperforming the selective deposition process. In such embodiments, thesilicon layer fills a remainder of the bottom portion of the isolationtrench and the polysilicon layer fills a remainder of the top portion ofthe isolation trench.

Another exemplary device includes a silicon-on-insulator substrate thatincludes a first silicon layer, a second silicon layer disposed over thefirst silicon layer, and a first insulator layer disposed between thefirst silicon layer and the second silicon layer. The device furtherincludes a multilayer polysilicon-comprising isolation structure thatsurrounds and isolates an active device region. The multilayerpolysilicon-comprising isolation structure extends through the secondsilicon layer and the first insulator layer of the silicon-on-insulatorsubstrate to the first silicon layer of the silicon-on-insulatorsubstrate. The multilayer polysilicon-comprising isolation structureincludes a top polysilicon-comprising portion disposed over a bottompolysilicon-comprising portion. The top polysilicon-comprising portionis different than the bottom polysilicon-comprising portion. The devicefurther includes a second insulator layer disposed between andseparating the bottom polysilicon-comprising portion from the secondsilicon layer. The second insulator layer is further disposed betweenand separating the top polysilicon-comprising portion from the secondsilicon layer. In some embodiments, the top polysilicon-comprisingportion has a first boron concentration, the bottompolysilicon-comprising portion has a second boron concentration, and thefirst boron concentration is less than the second boron concentration.In some embodiments, the first boron concentration decreases from aninterface between the top polysilicon-comprising portion and the bottompolysilicon-comprising portion to a topmost surface of the toppolysilicon-comprising portion. In some embodiments, the first boronconcentration at the topmost surface of the top polysilicon-comprisingportion is less than about 6×10¹⁸ atoms/cm³. In some embodiments, atotal depth of the multilayer polysilicon-comprising isolation structureis a sum of a first thickness of the top polysilicon-comprising portionand a second thickness of the bottom polysilicon-comprising portion,where the first thickness is less than the second thickness.

In some embodiments, the bottom polysilicon-comprising portion includesa first bottom polysilicon-comprising portion and a second bottompolysilicon-comprising portion. The first bottom polysilicon-comprisingportion is disposed between the second bottom polysilicon-comprisingportion and the top polysilicon-comprising portion. In such embodiments,the top polysilicon-comprising portion can have a first boronconcentration, the first bottom polysilicon-comprising portion can havea second boron concentration, and the second bottompolysilicon-comprising portion can have a third boron concentration,where the first boron concentration is less than the second boronconcentration and the first boron concentration is less than the thirdboron concentration. In some embodiments, the second boron concentrationof the first bottom polysilicon-comprising portion is less than thethird boron concentration of the second bottom polysilicon-comprisingportion. In some embodiments, the bottom polysilicon-comprising portionincludes dopants and the top polysilicon-comprising portion is free ofdopants. In some embodiments, the top polysilicon-comprising portionincludes a first top polysilicon-comprising portion and a second toppolysilicon-comprising portion. The first top polysilicon-comprisingportion is disposed between the second top polysilicon-comprisingportion and the bottom polysilicon-comprising portion. The first toppolysilicon-comprising portion and the bottom polysilicon-comprisingportion are doped layers, and the second top polysilicon-comprisingportion is a non-doped layer. In some embodiments, a first width of atop end of the multilayer polysilicon-comprising isolation structure isgreater than a second width of a bottom end of the multilayerpolysilicon-comprising isolation structure. In some embodiments, thefirst width is tapered. In some embodiments, the second width istapered. In some embodiments, the multilayer polysilicon-comprisingisolation structure extends partially through the first silicon layer ofthe silicon-on-insulator substrate.

Another exemplary method includes providing a silicon-on-insulatorsubstrate that includes a first silicon layer, a second silicon layerdisposed over the first silicon layer, and a first insulator layerdisposed between the first silicon layer and the second silicon layer.The method further includes forming an isolation trench in thesilicon-on-insulator substrate. The isolation trench extends through thesecond silicon layer and the first insulator layer of thesilicon-on-insulator substrate to the first silicon layer of thesilicon-on-insulator substrate. The method further includes forming asecond insulator layer that partially fills the isolation trench andforming a multilayer polysilicon-comprising isolation structure over thesecond insulator layer. The multilayer polysilicon-comprising isolationstructures fills a remainder of the isolation trench and surrounds andisolates an active device region. In some embodiments, forming themultilayer polysilicon-comprising isolation structure includesperforming a selective deposition process to form a firstsilicon-comprising layer over the first silicon layer of thesilicon-on-insulator substrate and the second insulator layer andperforming a non-selective deposition process to form a secondsilicon-comprising layer over the first silicon-comprising layer and thesecond insulator layer. The first silicon-comprising layer fills a lowerportion of the remainder of the isolation trench, and the secondsilicon-comprising layer fills an upper portion of the remainder of theisolation trench. The method further includes forming a device in theactive device region. In some embodiments, parameters of the selectivedeposition process are tuned to promote growth of the firstsilicon-comprising layer from the first silicon layer of thesilicon-on-insulator substrate. In some embodiments, performing theselective deposition process includes using a deposition precursor andan etching precursor and performing the non-selective deposition processincludes using only the deposition precursor. In some embodiments,performing the selective deposition process further includes using adopant precursor. In some embodiments, the selective deposition processand the non-selective deposition process are performed in-situ. In someembodiments, forming the multilayer polysilicon-comprising isolationstructure further includes performing a planarization process to removethe second silicon-comprising layer from over a top surface of thesilicon-on-insulator substrate.

The foregoing outlines features of several embodiments so that thoseskilled in the art may better understand the aspects of the presentdisclosure. Those skilled in the art should appreciate that they mayreadily use the present disclosure as a basis for designing or modifyingother processes and structures for carrying out the same purposes and/orachieving the same advantages of the embodiments introduced herein.Those skilled in the art should also realize that such equivalentconstructions do not depart from the spirit and scope of the presentdisclosure, and that they may make various changes, substitutions, andalterations herein without departing from the spirit and scope of thepresent disclosure.

What is claimed is:
 1. A device comprising: a semiconductor-on-insulatorsubstrate that includes a first semiconductor layer, a secondsemiconductor layer disposed over the first semiconductor layer, and aninsulator layer disposed between the first semiconductor layer and thesecond semiconductor layer; and an isolation structure that surrounds anactive region of the semiconductor-on-insulator substrate, wherein theisolation structure extends through the second semiconductor layer andthe insulator layer of the semiconductor-on-insulator substrate to thefirst semiconductor layer of the semiconductor-on-insulator substrate,and further wherein the isolation structure includes: a first insulatorsidewall spacer, a second insulator sidewall spacer, and a multilayersilicon-comprising isolation structure disposed between the firstinsulator sidewall spacer and the second insulator sidewall spacer,wherein the multilayer silicon-comprising isolation structure includes atop polysilicon portion disposed over a bottom silicon portion.
 2. Thedevice of claim 1, wherein the top polysilicon portion has a firstthickness, the bottom silicon portion has a second thickness, a sum ofthe first thickness and the second thickness is equal to a depth of theisolation structure in the semiconductor-on-insulator substrate, and thesecond thickness is greater than the first thickness.
 3. The device ofclaim 1, wherein the bottom silicon portion includes dopants and the toppolysilicon portion is free of dopants.
 4. The device of claim 1,wherein the bottom silicon portion includes a first silicon layer and asecond silicon layer, the first silicon layer has a first dopantconcentration, the second silicon layer has a second dopantconcentration, the first silicon layer is disposed between the toppolysilicon portion and the second silicon layer, and the first dopantconcentration is less than the second dopant concentration.
 5. Thedevice of claim 1, wherein the top polysilicon portion has a gradientdopant concentration that decreases from a first dopant concentration atan interface of the top polysilicon portion and the bottom siliconportion to a second dopant concentration at a top surface of the toppolysilicon portion.
 6. The device of claim 5, wherein a topmost surfaceof the top polysilicon portion is substantially dopant free.
 7. Thedevice of claim 1, wherein the top polysilicon portion has a taperedwidth.
 8. The device of claim 1, wherein the bottom silicon portion hasa first portion having a first tapered width, a second portion having asubstantially uniform width, and a third portion having a second taperedwidth, wherein the second portion is disposed between the first portionand the second portion.
 9. A device comprising: a silicon-on-insulatorsubstrate having a first silicon layer, an insulator layer disposed overthe first silicon layer, and a second silicon layer disposed over theinsulator layer; a first isolation structure disposed in thesilicon-on-insulator substrate, wherein the first isolation structureextends to a first depth in the silicon-on-insulator substrate; and asecond isolation structure disposed in the silicon-on-insulatorsubstrate, wherein the second isolation structure extends through thefirst isolation structure to a second depth in the silicon-on-insulatorsubstrate that is greater than the first depth, wherein the secondisolation structure includes a polysilicon capping layer disposed over asilicon layer, and wherein a sum of a first thickness of the polysiliconcapping layer and a second thickness of the silicon layer is equal tothe second depth of the second isolation structure.
 10. The device ofclaim 9, wherein the second isolation structure further includes anoxide layer that separates first sidewalls of the polysilicon cappinglayer from the first isolation structure and further separates secondsidewalls of the silicon layer from the first isolation structure andthe silicon-on-insulator substrate.
 11. The device of claim 10, whereina length of the oxide layer is equal to the second depth of the secondisolation structure.
 12. The device of claim 9, wherein the firstthickness of the polysilicon capping layer is less than the first depthof the first isolation structure.
 13. The device of claim 9, wherein thefirst isolation structure and the second isolation structure form anisolation ring that surrounds an active region of thesilicon-on-insulator substrate and a device is disposed in the activeregion.
 14. The device of claim 9, wherein the second isolationstructure physically contacts the second silicon layer of thesilicon-on-insulator substrate.
 15. The device of claim 9, wherein a topend of the second isolation structure is wider than a bottom end of thesecond isolation structure.
 16. The device of claim 9, wherein thesilicon layer is a boron-doped silicon layer and the polysilicon cappinglayer is free of boron.
 17. A method comprising: receiving asemiconductor-on-insulator substrate that includes a first semiconductorlayer, an insulator layer disposed over the first semiconductor layer,and a second semiconductor layer disposed over the insulator layer;forming an isolation trench in the semiconductor-on-insulator substrate,wherein the isolation trench extends through the second semiconductorlayer and the insulator layer to expose the second semiconductor layerof the semiconductor-on-insulator substrate; performing a selectivedeposition process to form a silicon layer that fills a bottom portionof the isolation trench; and performing a non-selective depositionprocess to form a polysilicon layer that fills a top portion of theisolation trench.
 18. The method of claim 17, wherein the selectivedeposition process and the non-selective deposition process are formedin-situ.
 19. The method of claim 17, wherein the performing theselective deposition process includes using a silicon-containingprecursor and an etchant-containing precursor and the performing thenon-selective deposition process includes using the silicon-containingprecursor but not the etchant-containing precursor.
 20. The method ofclaim 17, wherein the insulator layer is a first insulator layer and themethod further comprises forming a second insulator layer alongsidewalls of the isolation trench before performing the selectivedeposition process, such that the silicon layer fills a remainder of thebottom portion of the isolation trench and the polysilicon layer fills aremainder of the top portion of the isolation trench.